Ultrasonic Soldering Equipment
Benefits and Applications
Ultrasonic energy introduced into a dip solder pot eliminates the need for flux while enhancing many soldering processes. It also provides a means to bond solder to a number of materials including aluminum and glass that are difficult or impossible to solder using conventional soldering techniques. Blackstone-NEY Ultrasonics has perfected a technique for introducing ultrasonic energy into dip solder pots and is the exclusive manufacturer of this type of equipment in the world today.
Blackstone-NEY Ultrasonics' solder pots are activated by externally mounted transducers which allow large volume multi-part dipping. The systems' controls are adaptable to automated lines.
Blackstone~NEY Ultrasonics has many years of experience in ultrasonic soldering, dating from the early design and production of some of the first practical equipment for this purpose in the early 1960's. Our experience assures quality and competence in this field.
Ultrasonic soldering finds application in two major areas. They are the pre-tinning and soldering of precision, high reliability electronic components and the joining of aluminum heat exchangers.
Electronic Component Tinning and Soldering
Component lead solderability is a major consideration when devices are to be incorporated into high reliability hardware such as that used by the military, human implants including pacemakers and defibrillators, and for aerospace applications. This is especially true in cases where the device, once installed, is not accessible for service. In these critical applications it is commonplace to "tin" component leads when they arrive at the assembly house and prior to going into storage. In some cases the component leads may again be "tinned" immediately prior to use. Ultrasonic tinning offers several advantages over conventional flux methods for high reliability lead tinning.
No Flux
The ultrasonic soldering process does not use flux. Ultrasonic cavitation and implosion provide the mechanism to mechanically remove surface oxides to allow solder adhesion to take place. Since there is no flux used, there is no chance of solder splatter or the inclusion of flux or flux decomposition byproducts in the solder coating. The necessity to remove flux residues after soldering is also eliminated.
No Wicking
Since there is no flux, there is no "wicking" of solder above the solder level. This means that solder will not wick into stranded wires or into connector contacts.
Quick, Thorough Plating Removal
The ultrasonic soldering process excels in the removal of protective gold, silver, and other platings from lead surfaces. Military and NASA specifications recommend ultrasonic soldering for gold removal.
Part Recovery
Ultrasonic tinning has been successful in restoring the solderability of component leads that could not be recovered using the fluxes allowed by military and other specifications. The vigorous mechanical scrubbing provided by ultrasonic energy surpasses many other mechanical recovery techniques.
Note - There are some applications that are unsuitable for ultrasonic soldering. For instance, the tinning of unplated strand wire cannot be handled well with ultrasonic soldering because wicking is necessary to thoroughly penetrate the strands with solder. Soldering of through hole printed circuit boards and the tinning of insulated magnet wire are also unsuitable applications because of the need for capillary flow.
Aluminum Heat Exchangers
Ultrasonic soldering has made it possible to use aluminum as a material of construction in a number of heat exchanger applications
Hairpin - Return Bend Coils
Ultrasonic soldering has been widely used to solder all aluminum heat exchangers of the hairpin - return bend design used in automotive applications as well as in room and central air conditioning systems.
Copper/Aluminum Transition Joints
The otherwise difficult transition from aluminum to copper tube required in straight tube and serpentine coil applications is easily accomplished using parts that are ultrasonically pretinned. Properly designed and prepared parts can be joined using heat alone.
Construction
Ultrasonic Transducers
Blackstone~NEY Ultrasonics' unique composite piezoelectric transducers are permanently mounted to the outside of the solder pot in such a way that the entire solder volume is ultrasonically activated. Specially designed coupling members efficiently transmit ultrasonic energy to the solder while minimizing heat transfer, thereby protecting the transducers from heat damage.
Solder Pots
The solder vessels used in Blackstone~NEY Ultrasonics ultrasonic soldering systems are made of 300 series stainless steel to assure long life and resistance to corrosion. A "cold zone" flange prevents solder creep and possible damage due to spillage of solder.
Ultrasonic Generators
Completely solid state ultrasonic generators are automatically tuned and give long, reliable performance. Fan cooling allows continuous duty operation even in high ambient temperature locations.
Control Systems
Various solid state control packages are available to meet most laboratory and production requirements. Control circuits can be linked with surrounding equipment in the design of totally or semi-automated operations.
Solder Choice
Blackstone~NEY Ultrasonics' soldering equipment is supplied with the solder alloy of your choice. Standard solders are 63% Tin-37% Lead and 95% Zinc-5% Aluminum. Other solders should be supplied or specified by the customer for proper equipment adjustments necessary prior to delivery.
Features
- Patented high efficiency piezoelectric transducers permanently attached to solder vessel
- Adjustable solid state thermocouple temperature control
- Temperature read-out on all TP-3D-2 and TP-6B units
- 300 series stainless steel solder vessel
- Stainless steel exterior surfaces
- Totally activated solder volume
- Solid state "autotuned" ultrasonic system
- Designed to withstand total power shutdown
- Fan cooled transducer and ultrasonic system
- Electrically grounded solder pot
Specifications
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TP-3D
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TP-3D-2
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TP-6B-2*
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Dimensions
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Solder Pot Internal
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3" Diameter x 1" Deep
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9"x4"x3" Deep
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Pot Module Overall |
6 1/2" x 6 1/2" x 9 3/4" High |
16 1/2"x10"x14" High** |
Control Module Overall |
9 7/8"x10 1/8"x 5 3/4" High |
25 1/4"x9 1/8"x14 1/2" High |
25 1/4"x9 1/8"x14 1/2" High |
Ultrasonic Frequency |
21 kHz |
45 kHz |
Transducers |
High Efficiency Composite Piezoelectric |
Temperature Range |
0 to 800 degrees F |
100 to 1000 degrees F |
Temperature Control |
Thermocouple Type Solid State |
Temperature Readout |
Not Available |
Standard |
Pot Heaters |
500 Watts |
3000 Watts |
Ultrasonic Timer |
Not Available |
Optional |
Foot Switch |
Standard |
Optional |
Ultrasonic Power Control |
Not Available |
Optional |
Power Requirements |
120 Volts 50/60 Hz 1 KVA |
240 Volts 50/60 Hz 3.5 KVA |
*Longer pots with the basic TP-6B-2 cross section (4" wide x 3" deep) are available on special order.
**Height adjustable to 16" with leveling feet.
Specifications subject to change without notice.
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